Supporting the world's installed base of legacy KLA inspection and metrology systems — from evaluation through long-term lifecycle support.
The installed base of legacy KLA systems remains critical to mature-node semiconductor manufacturing worldwide.
As platforms age and transition beyond original support horizons, lifecycle support is increasingly important. Managing these assets requires specialized knowledge, dedicated infrastructure, and structured engineering methodologies.
Bridge Tronic Global is making disciplined investments in this technical practice to ensure these critical platforms can be supported, validated, and maintained long-term.
Dedicated technical knowledge across multiple legacy KLA product families.
Engineering support from evaluation through long-term lifecycle planning.
Documented, repeatable engineering frameworks — not reactive repairs.
BTG supports factory-refurbishment programs for supported legacy KLA inspection and metrology systems. Refurbishment scope is developed around the system model, configuration, condition, intended application, and customer requirements.
BTG continues making disciplined investments in engineering talent, facility infrastructure, technical documentation, specialized tooling, and strategic technical partnerships to expand the technologies, platforms, and solutions we provide.
BTG Engineering supports multiple legacy KLA product families through dedicated platform knowledge, engineering expertise, lifecycle support, and continuous technical development.
KLA Surfscan platforms for bare-wafer and unpatterned-wafer particle, defect and haze inspection — from early cassette-to-cassette systems through the SP-generation UV platforms.
Legacy cassette-to-cassette surface inspection system for 50–150 mm wafers with 200 nm PSL-equivalent sensitivity and haze measurement capability.
Legacy 50–200 mm particle and haze inspection system using 633 nm HeNe illumination with 200 nm particle sensitivity.
Legacy 50–200 mm Surfscan platform for particle and haze monitoring with 200 nm particle sensitivity on bare silicon and unpatterned film surfaces.
Single-puck 6000-series system covering 50–200 mm wafers with 157 nm PSL-equivalent sensitivity at 95% capture and haze measurement.
488 nm argon-ion surface inspection platform with 100 nm nominal sensitivity and multi-pitch scan recipes for 50–200 mm wafers.
High-sensitivity 50–200 mm inspection system with 112 nm at 90% capture and up to 100 wph at 200 mm using low-angle darkfield illumination.
Versatile 100–200 mm inspection system rated to 150 nm at 95% capture on polished silicon, with darkfield capability across polished and high-scattering surfaces.
Refurbishable 50–200 mm platform conservatively rated to 120 nm at 95% capture and 0.02 ppm haze using low-angle darkfield illumination.
Original SP1-generation platform, commonly called SP1 Classic, with 80 nm sensitivity on polished silicon and darkfield haze capability for 150–300 mm wafers.
Legacy triple-beam SP1 platform for 150 / 200 / 300 mm wafers with 60 nm oblique sensitivity and optional edge and backside inspection.
Legacy dual-laser SP1 platform combining brightfield and darkfield channels with 50 nm sensitivity on prime bare silicon for 200 / 300 mm wafers.
UV 200 / 300 mm surface inspection platform conservatively rated to the 37 nm class using 355 nm solid-state illumination and multi-mode surface quality analysis.
KLA UV and ASET thin-film measurement platforms for film thickness, refractive index and reflectivity — from the UV-1XY0 series through the ASET-F5x with optional spectroscopic ellipsometry.
Automated legacy UV thin-film metrology for 100–200 mm wafers.
Automated DBS / VTF thin-film measurement with dual-finger wafer handling.
First-generation production UV spectroscopic ellipsometry platform.
Automated UV thin-film metrology combining DBS and small-spot spectroscopic ellipsometry.
Third-generation ASET platform combining spectroscopic ellipsometry and dual-beam spectrophotometry for advanced film stacks.
Enhanced 100–300 mm ASET platform with DBS, spectroscopic ellipsometry and optional SWE for complex film-stack characterization.
KLA OmniMap RS-Series four-point-probe sheet-resistance mapping systems for implant, diffusion, epitaxy, metals, polysilicon and bulk-substrate characterization — from manual RS-35C through automated 300 mm RS-100.
Manual / tabletop configuration for semiconductor sheet-resistance mapping.
Manual, non-TC configuration for semiconductor sheet-resistance mapping.
Manual with temperature compensation configuration for semiconductor sheet-resistance mapping.
Automated, non-TC configuration for semiconductor sheet-resistance mapping.
Automated with temperature compensation configuration for semiconductor sheet-resistance mapping.
Manual, non-TC configuration for semiconductor sheet-resistance mapping.
Manual with temperature compensation configuration for semiconductor sheet-resistance mapping.
Automated, non-TC configuration for semiconductor sheet-resistance mapping.
Automated with temperature compensation configuration for semiconductor sheet-resistance mapping.
Automated 300 mm production platform configuration for semiconductor sheet-resistance mapping.
KLA 8100-through-8250 CD-SEM platforms for wafer and reticle critical-dimension metrology — three series generations covering mid-1990s through early-2000s 0.13 µm production.
The 8100 Series spans the initial wafer production platform (8100, 1995), its reticle-capable variant (8100-R, 1996), the enhanced 8100E, and the extended 8100XP / 8100XP-R generation for 0.18 µm production. Detailed configuration specifications are historical and secondary; BTG qualifies each specific system individually.
Specifications cited above are drawn from historical, secondary and field sources. Values are not serial-number-specific acceptance limits. Contact BTG Engineering for platform and configuration review.
The 8200 Series represents the transitional 200 mm generation preceding the well-documented 8250 family. Detailed serial-specific specifications for the 8200 are less complete in available documentation than either the 8100 or 8250 generations. BTG qualifies each specific system individually.
Specifications cited above are drawn from historical, secondary and field sources. Values are not serial-number-specific acceptance limits. Contact BTG Engineering for platform and configuration review.
The 8250 Series (launched circa 2000) is the strongest-documented generation in the retained 8100-through-8250 scope. It includes the standard 8250 wafer platform, the 8250-R reticle-capable configuration, and field-documented variants. The 8250-R is documented at better than 2 nm repeatability. Exact contractual resolution, repeatability and throughput must come from final-test or site-acceptance records for each system.
Specifications cited above are drawn from historical, secondary and field sources. Values are not serial-number-specific acceptance limits. Contact BTG Engineering for platform and configuration review.
Selected discontinued KLA / Tencor stylus profilers — Alpha-Step IQ, P-Series and HRP-Series — for surface topography, step height, roughness, bow and stress measurement. Current-production KLA stylus profilers are not included.
Legacy benchtop stylus profiler for step height, roughness and surface profiling.
Early-generation stylus profiler platform
Legacy benchtop stylus profiler; second-generation platform
Manual stylus profiler for laboratory and production measurement
Production stylus profiler with sample handling capability
Automated stylus profiler with cassette-based wafer handling
Production stylus profiler; mid-series platform
Production stylus profiler with automated stage capability
Production stylus profiler for 200 mm and legacy wafer formats
High-capability production stylus profiler
Advanced production stylus profiler with automated handling options
High-capability stylus profiler for advanced measurement applications
High-resolution stylus profiler; earlier-generation platform
High-resolution stylus profiler with enhanced scan capability
High-resolution stylus profiler; mid-generation platform
High-resolution stylus profiler; later-generation platform
High-resolution stylus profiler with automated handling
High-resolution stylus profiler; advanced later-generation platform
Many of these resources remain internal and support consistent execution across every customer engagement.